Blueprint studio · Spec sheets · Amber callouts · Free shipping over $75
Sheet A · Product board
Unit price
USD10.99
USD58.99

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Field rating
4.3

Verified studio score · Spec revision current

Fit · Size

MECHANIC Heat-Mini IC Glue Removal Station for Chips up to 18*21mm Clearance Items Compatibility: For iPhone 12 Pro

SKU: 28947928713

Dispatch

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 4 - Sep 9

Description

Compatibility: For iPhone 12 Pro

ultra-precision cutting

Sensor:16MP COMS

can be connected to mobile phone and computer

MECHANIC Heat-Mini IC Glue Removal Station for Chips up to 18*21mm Clearance Items Compatibility: For iPhone 12 ProMECHANIC Heat Mini Heating Station for Mobile Phone CPU IC Glue Removal. Intelligent one click heating, adjustable from 160C to 250C. Easily removes adhesive glue with a brush without damaging the chip. The 18*21mm heating area is compatible with most mobile phone chips, Nand Flash, CPUs, and other tasks involving adhesive and solder removal. Features: 1. Employs a professional temperature control curve algorithm with a built in factory calibrated

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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