HMT-X1 Motherboard Layering Chip Glue Removal Heating Table Voltage:110V Features a CVT (Continuously Variable

Features a CVT (Continuously Variable Transmission) system that provides high torque

In System Programming (ISP) now possible for MMC and UFS flash memory types

Length adjustment: Fix the grinding moving length by adjusting the stop block

E-Mate X EMMC BGA - Compatible Boxes:

HMT-X1 Motherboard Layering Chip Glue Removal Heating Table Voltage:110V Features a CVT (Continuously VariableHMT X1 ZJ X1 multi functional motherboard layered chip glue removal heating table for iPhone 16 15 14 13 12 11 X PCB layering tinning repair and chip glue removal. HMT X1 360W universal motherboard delamination and degumming heating table for mobile phone motherboard repair. Features: 1. Temperature control imported from Germany, rapid heating. 2. Turn on the chip degumming station temperature switch, the chip degumming station starts to heat up. 3.