JTX JP-1 Universal Preheater for Phone PCB Layering Glue Removal Model:JTX JP-1 Preheater OCP current value: 0-5A Accuracy:

OCP current value: 0-5A Accuracy: ±0

11 AC wireless communication protocol

iBooter Standard with JCID Drawing 2 Years: iBooter + 1x 4-in-1 HUB boot cable + iPhone 12-14 Pro Max FPC cable(8pcs) + JCID Drawing 2 years account

Full Black Observation Distance: 300m (max)

JTX JP-1 Universal Preheater for Phone PCB Layering Glue Removal Model:JTX JP-1 Preheater OCP current value: 0-5A Accuracy:JTX JP 1 300W Universal Preheating Platform for mobile phone iPhone motherboard layering, lamination, reballing tinning, and glue removal repair. JTX JP 1 heating station is suitable for mobile phone PCB repair, circuit board CPU chip reballing, BGA chip and FPC connector socket and other precision parts disassembly and assembly. Features: 1. Universal heating platform is suitable for mobile phone motherboard layering, lamination, tinning, and glue